LED Copper-Aluminium Clad Heat Sink Substrate

• Customization: Available
• Application: Decorations
• Certification: ISO9001
• Model NO.: 1060
• Specification: thicknes0.3mm-1.8mm
• Trademark: ZEGOTA
• Origin: China
• Production Capacity: 50000ton

Product Description

Product Description
Used in the LED lighting industry encapsulation heat dissipation substrate, LED chips are directly encapsulated in the copper surface, the heat generated by the chip from the copper directly have a point of conduction to the whole surface, and then through the aluminium dispersed, giving full play to the good thermal conductivity of copper and aluminium good heat dissipation performance, is currently an ideal not only to improve the thermal conductivity of the LED chip, heat dissipation efficiency, and can reduce the cost of production of a new COB encapsulation of the heat dissipation of the substrate material.
Specification

Name	LED Copper-Aluminium Clad Heat Sink Substrate
Thickness	0.3~2.0mm
Width	600~1000mm
State of Affairs	H18/H24
Clad Rate	100%
Tensile Strength	130~220MPa
Elongation	10~20%
Copper Layer Thickness Ratio	10~20%

Features
1,Flat plate shape, high mechanical strength.
2,Metallurgical bonding between copper and aluminium,
3,No delamination in extreme cold and heat.
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Company Profile
Zhejiang ZEGOTA Precision Technology Co.,LTD
Our company dedicate to precision technology innovation. As a technical enterprise, we highly specialized our R&D capability to make high quality and high performance products through continuous investment in staff training and sophisticated equipment, and to promote the construction of an intensive society for efficient utilization of materials and exploring future manufacturing ways