• Copper-Aluminium Clad Communication Substrate Materials
  • Copper-Aluminium Clad Communication Substrate Materials
  • Copper-Aluminium Clad Communication Substrate Materials
  • Copper-Aluminium Clad Communication Substrate Materials

Copper-Aluminium Clad Communication Substrate Materials

Application: Decorations
Certification: ISO9001
Specification: thicknes0.3mm-2.0mm
Trademark: ZEGOTA
Origin: China
Samples:
US$ 12/kg 1 kg(Min.Order)
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Customization:
Gold Member Since 2019

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Basic Info.

Model NO.
1060

Product Description

Product Description
Communication Substrates are mainly used in 3G, 4G and the upcoming construction of 5G network base stations used in communication RF devices and RF structural components. At present, the main substrate used is aluminium copper plating technology, our company developed a Copper-Aluminium Clad process, the production process is environmentally friendly, the copper layer is rolled tissue structure, the thickness of the copper layer is several times the thickness of the electroplated copper layer, the product quality is stable, the production efficiency is high, and the final product is more cost-effective.

Specification
Name Copper-Aluminium Clad Communication
Substrate Materials
Thickness 0.3~2.0mm
Width 600~1000mm
Statue H18/H24
Thickness ratio of copper layer 10~20%
Tensile Strength 130~220MPa
Elongation 10~20%
Main Application Areas:
LED Packaging Heat Dissipation Substrate

Features
1,High reliability
The thickness of the transition layer between copper and aluminium at the interface is 1~2 μm, which effectively solves the problems of low resistance of the transition layer and the bonding strength between copper and aluminium in other similar products.
2. Long service life
Copper and aluminium clad interface bonding strength of more than 40MPa, can withstand long periods of time, high-frequency cold and heat shock generated by the stress, and does not reduce the bonding strength of the material.
3, high electrical conductivity
In the copper volume ratio of 20%, its resistivity is less than 0.0245Ω?mm?/m, the current-carrying capacity can reach 89% of the copper row, its temperature rise and short resistance can meet the requirements of low-voltage switchgear. Without changing the structure of electric control and distribution equipment, no need to re-design, easy to change.
4,High cost performance
When applied under the same conditions, the weight is less than half of pure copper, which has significant application cost advantages.

Image
Copper-Aluminium Clad Communication Substrate MaterialsCopper-Aluminium Clad Communication Substrate Materials

Company Profile
Zhejiang ZEGOTA Precision Technology Co.,LTD
Our company dedicate to precision technology innovation. As a technical enterprise, we highly specialized our R&D capability to make high quality and high performance products through continuous investment in staff training and sophisticated equipment, and to promote the construction of an intensive society for efficient utilization of materials and exploring future manufacturing ways
Copper-Aluminium Clad Communication Substrate Materials

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