Copper-Aluminium Clad Communication Substrate Materials

Product Details
Customization: Available
Color: Silver
Application: LED Packaging Heat Dissipation Substrate
Still deciding? Get samples of US$ 12/kg
Request Sample
Gold Member Since 2019

Suppliers with verified business licenses

Audited Supplier

Audited by an independent third-party inspection agency

Number of Employees
9
Year of Establishment
2018-11-19
  • Copper-Aluminium Clad Communication Substrate Materials
  • Copper-Aluminium Clad Communication Substrate Materials
  • Copper-Aluminium Clad Communication Substrate Materials
  • Copper-Aluminium Clad Communication Substrate Materials
  • Copper-Aluminium Clad Communication Substrate Materials
Find Similar Products

Basic Info.

Model NO.
1060
Certification
ISO9001
Specification
thicknes0.3mm-2.0mm width 600mm-1000mm
Trademark
ZEGOTA
Origin
China
Production Capacity
1000ton

Product Description

Product Description
 
Communication Substrates are mainly used in 3G, 4G and the upcoming construction of 5G network base stations used in communication RF devices and RF structural components. At present, the main substrate used is aluminium copper plating technology, our company developed a Copper-Aluminium Clad process, the production process is environmentally friendly, the copper layer is rolled tissue structure, the thickness of the copper layer is several times the thickness of the electroplated copper layer, the product quality is stable, the production efficiency is high, and the final product is more cost-effective.
Copper-Aluminium Clad Communication Substrate Materials
Specification
Name Copper-Aluminium Clad Communication
Substrate Materials
Thickness 0.3~2.0mm
Width 600~1000mm
Statue H18/H24
Thickness ratio of copper layer 10~20%
Tensile Strength 130~220MPa
Elongation 10~20%

Main Application Areas:
LED Packaging Heat Dissipation Substrate
Copper-Aluminium Clad Communication Substrate Materials


Features

1,High reliability
The thickness of the transition layer between copper and aluminium at the interface is 1~2 μm, which effectively solves the problems of low resistance of the transition layer and the bonding strength between copper and aluminium in other similar products.
2. Long service life
Copper and aluminium clad interface bonding strength of more than 40MPa, can withstand long periods of time, high-frequency cold and heat shock generated by the stress, and does not reduce the bonding strength of the material.
3, high electrical conductivity
In the copper volume ratio of 20%, its resistivity is less than 0.0245Ω?mm?/m, the current-carrying capacity can reach 89% of the copper row, its temperature rise and short resistance can meet the requirements of low-voltage switchgear. Without changing the structure of electric control and distribution equipment, no need to re-design, easy to change.
4,High cost performance
When applied under the same conditions, the weight is less than half of pure copper, which has significant application cost advantages.

Company Profile
Zhejiang ZEGOTA Precision Technology Co.,LTD
Our company dedicate to precision technology innovation. As a technical enterprise, we highly specialized our R&D capability to make high quality and high performance products through continuous investment in staff training and sophisticated equipment, and to promote the construction of an intensive society for efficient utilization of materials and exploring future manufacturing ways



Copper-Aluminium Clad Communication Substrate Materials

Send your message to this supplier

*From:
*To:
*Message:

Enter between 20 to 4,000 characters.

This is not what you are looking for? Post a Sourcing Request Now
Contact Supplier