Customization: | Available |
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Color: | Silver |
Application: | LED Packaging Heat Dissipation Substrate |
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Name | Copper-Aluminium Clad Communication Substrate Materials |
Thickness | 0.3~2.0mm |
Width | 600~1000mm |
Statue | H18/H24 |
Thickness ratio of copper layer | 10~20% |
Tensile Strength | 130~220MPa |
Elongation | 10~20% |