LED Aluminium-Copper Composite Heat Sink Substrate

• Type: Radiator
• Standard: ASTM, AISI
• Certification: ISO, RoHS
• Application: Conductive Industry
• Stock: Stock
• Transport Package: as Required
• Model NO.: ZGT LAC1
• Trademark: zegota
• Origin: China
• Production Capacity: 1000

Product Description

Product Specification

Specification
Material	Copper-Aluminum
Metal Grades	CA13
Specifications	Thickness(0.3-2.0mm)   Width (600-1000mm)
Product Status	H18/H24
Compounding Rate	100%
Tensile Strength	130-220MPa
Elongation	10-20%
Copper Layer Thickness Ratio	10-20%

Product Description
  Our many patented technology production of copper and aluminium composite plate and strip. The plate shape is flat, high mechanical strength, metallurgical combination between copper and aluminum, rapid cold and heat without delamination, the overall material thermal resistance is small, used in the LED lighting industry, LED chips are directly encapsulated in the copper surface. The heat generated by the chip is directly conducted by copper and then dissipated through aluminium, giving full play to copper's good thermal conductivity and aluminium's good heat dissipation performance, which is currently the most ideal COB package thermal substrate material.

Factory


Company Profile
Zhejiang ZEGOTA Precision Technology Co.,LTD
Our company dedicate to precision technology innovation. As a technical enterprise, we highly specialized our R&D capability to make high quality and high performance products through continuous investment in staff training and sophisticated equipment, and to promote the construction of an intensive society for efficient utilization of materials and exploring future manufacturing ways