| Customization: | Available |
|---|---|
| Type: | Radiator |
| Standard: | ASTM, AISI |
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Product Specification
| Specification | |
| Material | Copper-Aluminum |
| Metal Grades | CA13 |
| Specifications | Thickness(0.3-2.0mm) Width (600-1000mm) |
| Product Status | H18/H24 |
| Compounding Rate | 100% |
| Tensile Strength | 130-220MPa |
| Elongation | 10-20% |
| Copper Layer Thickness Ratio | 10-20% |
Product Description
Our many patented technology production of copper and aluminium composite plate and strip. The plate shape is flat, high mechanical strength, metallurgical combination between copper and aluminum, rapid cold and heat without delamination, the overall material thermal resistance is small, used in the LED lighting industry, LED chips are directly encapsulated in the copper surface. The heat generated by the chip is directly conducted by copper and then dissipated through aluminium, giving full play to copper's good thermal conductivity and aluminium's good heat dissipation performance, which is currently the most ideal COB package thermal substrate material.
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