Product Description
USE TO:
Mainly used in base stations in 4G, and 5G networks, currently we mainly use aluminum copper plating technology outside of our home country. However, the aluminum copper plating process is recommended to cause serious pollution and limited production.
The copper aluminum composite process developed by our company is environmentally friendly in production process, followed only by mechanical processing, with stable quality and high production efficiency, meeting the policy requirements of gj environmental protection.
Our company produces plates with flat shapes, high mechanical strength, metallurgical bonding between copper and aluminum, and no layering during extreme cold and hot conditions.
LED chips are directly packaged on the copper surface, and the heat generated by the chip is directly transmitted from one point of copper to the entire surface, and then exported through aluminum, fully leveraging the good thermal conductivity of copper and the good heat dissipation performance of aluminum.
ADVANTAGE:
The product has the characteristics of extending its service life, achieving equal power intensive and miniaturized design, and is currently the ideal COB packaging heat dissipation substrate material.
The copper aluminum composite radiator plate fully utilizes the thermal conductivity of copper and the heat dissipation performance of aluminum, enabling the effective combination of the two metals. Satisfied the design requirements for miniaturization and lightweight of the heat dissipation system. Suitable for radiators and heat dissipation modules in industrial appliances, LED, PC, and new energy vehicle industries.
PRODUCT SIZE:
Thickness: 0.3-2.0mm; Width: 600-1000mm; Status: H18/H24
technical parameter
Compound rate: 100%;
Tensile strength: 130-220MPa;
Elongation rate: 10-20%;
Copper layer thickness ratio: 10-20%.
Audited Supplier 
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